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Custom Interconnect Limited

Andover / Global

Semiconductor Packaging Process Engineer – NPI

Job Description

Custom Interconnect Limited is seeking an engineer to support wafer process, die bond, wire bond or encapsulation within semiconductor packaging. The role covers operation, development and maintenance of processes and equipment.

You will work with Lead/Senior Engineers on process design, NPI, data collection and quality investigations to drive continuous improvements on the production floor.

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